New trend of global 3D structural electronics rising: Mo Mo CHINA PLASTIC GRANULATORTO’s electronic market value will exceed $ 1 billion

Date:2022-8-08 Author:Sam

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IDTechex predicts that in the short term in the module in the short term, it is mainly applied to industries with relatively fast iteration of consumer electronics and other products.During the medium term, automobile interior applications will provide the largest market sales.
There are many types of e -type in the mold, from simple equipment of wearable technology, car interior, car interior in car interior The antenna and white home appliances touch panels to more complex sensors, forces, and monitors. Application Market Prospects
Close There are many types of prototypes, from simple equipment for wearable technology, car interior, antenna, and white appliances touch panels to more complex sensors, actors and displays.
模内电子的原型种类繁多,从可穿戴技术的简单设备,汽车内装,天线和白色家电触摸面板到更复杂的传感器、致动器和显示器等。
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The electron (IME) in the mold is a combination of traditional module injection -plastic decoration (IMD) technology and flexible printing circuit, which can be made 3D shape with different complexity embedded circuits. This is part of the rise of the global 3D structural electronics. Through the electronic technology in the mold, it can produce products with higher reliability without assembly and shell packaging.
The report is that the internal electron (IME) or internal structure electron (IMSE) is about to enter and grow rapidly. It is predicted that the overall market value will exceed $ 1.1 billion in 2029.
The advantages of electronics in the mold include: lightweight, space saving, solid durability, short product cycle, and high -throughput processing capabilities. However, there are also some limitations of this technology, such as limited shape, yield, software immature, environmental stability and post -processing problems.
There are many types of e -type in the mold, from simple equipment for wearable technology, car interior, antenna and white home appliances touch panels to more complex sensors, actors and displays.
ImeThe only technical solution for non -3D electronic products.Gas -soluble glue jet printing, mold interconnect equipment (including laser direct molding, two injection molding and film insertion) and 3D printing electronic products are rapidly emerging and attracted attention.
In the long run, the electrons in the mold will not only be applied to more affordable transportation, but also are expected to be applied to more daily equipment, including household appliances and white appliances.